EP2SGX30CF780I3 vs EP2SGX30CF780C5 Perbandingan

Perbandingan bersamaan detil EP2SGX30CF780I3 dari Intel dan EP2SGX30CF780C5 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ Waktu Beli Terakhir
Intel
EP2SGX30CF780C5 EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP2SGX30CF780I3 EP2SGX30CF780C5
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Waktu Pembelian Terakhir
Family Stratix II GX Stratix II GX
Logic Cells 33,880 —
Logic Array Blocks (LABs) 33,880 1694
Maximum Internal Frequency 622.08 MHz —
Number of User I/O Pins 361 —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V
Transceivers Embedded multi-gigabit transceivers (6.375 Gbps) Multi-gigabit transceivers with embedded CDR
Paket 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) 780-ball FBGA
Terminal Pitch 1.0 mm —
Suhu Kerja -40 °C to +85 °C (Industrial) —
Temperature Grade Suffix I3 (Industrial) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Total Terminals 780 —
Package Code BGA, square shape —
Status RoHS [DATA_NEEDED: RoHS status not confirmed in supplied data] [DATA_NEEDED: RoHS status]
Logic Elements — 33880
Maximum User I/O Pins — 361
Operating Temperature Grade — Commercial (0C to +85C)
Speed Grade — -5
PLLs — 4
Embedded Memory — M512 / M4K / M-RAM blocks (totals per datasheet)
DSP Blocks — Embedded multiplier/DSP blocks
Lead-Free — [DATA_NEEDED: lead-free status]

Spek dan Sumber

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