EP2SGX30CF780I3 vs EP2SGX30CF780C5 比較

詳細並排比較 EP2SGX30CF780I3 由 Intel 與 EP2SGX30CF780C5 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ 最後購買機會
Intel
EP2SGX30CF780C5 EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 ⚠ 最後購買機會

規格比較

參數 EP2SGX30CF780I3 EP2SGX30CF780C5
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 最後購買
Family Stratix II GX Stratix II GX
Logic Cells 33,880 —
Logic Array Blocks (LABs) 33,880 1694
Maximum Internal Frequency 622.08 MHz —
Number of User I/O Pins 361 —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V
Transceivers Embedded multi-gigabit transceivers (6.375 Gbps) Multi-gigabit transceivers with embedded CDR
封裝 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) 780-ball FBGA
Terminal Pitch 1.0 mm —
工作溫度 -40 °C to +85 °C (Industrial) —
Temperature Grade Suffix I3 (Industrial) —
安裝類型 Surface Mount (BGA) Surface Mount
Total Terminals 780 —
Package Code BGA, square shape —
RoHS 狀態 [DATA_NEEDED: RoHS status not confirmed in supplied data] [DATA_NEEDED: RoHS status]
Logic Elements — 33880
Maximum User I/O Pins — 361
Operating Temperature Grade — Commercial (0C to +85C)
Speed Grade — -5
PLLs — 4
Embedded Memory — M512 / M4K / M-RAM blocks (totals per datasheet)
DSP Blocks — Embedded multiplier/DSP blocks
Lead-Free — [DATA_NEEDED: lead-free status]

資料表與資源

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