EP2SGX30CF780I3 vs EP2SGX30CF780C5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780I3 sa pamamagitan ng Intel at EP2SGX30CF780C5 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Huling PagbiliIntel
EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel
EP2SGX30CF780C5 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX30CF780I3 | EP2SGX30CF780C5 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | 1694 |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | Multi-gigabit transceivers with embedded CDR |
| Packhaging | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FBGA |
| Terminal Pitch | 1.0 mm | — |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | — |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 33880 |
| Maximum User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | -5 |
| PLLs | — | 4 |
| Embedded Memory | — | M512 / M4K / M-RAM blocks (totals per datasheet) |
| DSP Blocks | — | Embedded multiplier/DSP blocks |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |