EP2SGX30CF780I3 vs EP2SGX30CF780I4 Perbandingan
Perbandingan bersamaan detil EP2SGX30CF780I3 dari Intel dan EP2SGX30CF780I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30CF780I3 | EP2SGX30CF780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | 622.08 MHz |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | — |
| Paket | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Terminal Pitch | 1.0 mm | — |
| Suhu Kerja | -40 °C to +85 °C (Industrial) | — |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | BGA (FineLine FBGA) |
| Status RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 33,880 |
| Logic Cells / CLBs | — | 33,880 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Terminal Form | — | Ball (BGA) |
| Number of Pins / Balls | — | 780 |
| Logic Family | — | CMOS |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |