EP2SGX30CF780I3 vs EP2SGX30CF780I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30CF780I3 disebabkan oleh Intel dan EP2SGX30CF780I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2SGX30CF780I3 | EP2SGX30CF780I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | 622.08 MHz |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | — |
| Kemasan | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Terminal Pitch | 1.0 mm | — |
| Suhu Operasi | -40 °C to +85 °C (Industrial) | — |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | BGA (FineLine FBGA) |
| Status RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 33,880 |
| Logic Cells / CLBs | — | 33,880 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Terminal Form | — | Ball (BGA) |
| Number of Pins / Balls | — | 780 |
| Logic Family | — | CMOS |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |