EP2SGX30CF780I3 vs EP2SGX30CF780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780I3 sa pamamagitan ng Intel at EP2SGX30CF780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP2SGX30CF780I3 | EP2SGX30CF780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | 622.08 MHz |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | — |
| Packhaging | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Terminal Pitch | 1.0 mm | — |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | — |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | BGA (FineLine FBGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 33,880 |
| Logic Cells / CLBs | — | 33,880 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Terminal Form | — | Ball (BGA) |
| Number of Pins / Balls | — | 780 |
| Logic Family | — | CMOS |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |