EP2SGX60EF1152C3N vs EP2SGX60EF1152C5N Perbandingan
Perbandingan bersamaan detil EP2SGX60EF1152C3N dari Intel dan EP2SGX60EF1152C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2SGX60EF1152C3N | EP2SGX60EF1152C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 | — |
| Logic Array Blocks (LABs) | 3022 | 3022 |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | — |
| Paket | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1152-ball FC-FBGA |
| Speed Grade | C3 (commercial, -3 bin) | -5 (mid) |
| Suhu Kerja | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Logic Elements (LE) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |