EP2SGX60EF1152C3N vs EP2SGX60EF1152C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152C3N disebabkan oleh Intel dan EP2SGX60EF1152C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60EF1152C3N | EP2SGX60EF1152C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 | — |
| Logic Array Blocks (LABs) | 3022 | 3022 |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | — |
| Kemasan | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1152-ball FC-FBGA |
| Speed Grade | C3 (commercial, -3 bin) | -5 (mid) |
| Suhu Operasi | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Logic Elements (LE) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |