EP2SGX60EF1152I3N vs EP2SGX60EF1152I3 Perbandingan

Perbandingan bersamaan detil EP2SGX60EF1152I3N dari Intel dan EP2SGX60EF1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2SGX60EF1152I3N EP2SGX60EF1152I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Family Stratix II GX Stratix II GX
Device Type Field-Programmable Gate Array (FPGA) —
Logic Elements (LEs) 60,440 60,440
Configurable Logic Blocks (CLBs) 60,440 —
Embedded Memory Bits 2,544,192 bits —
Internal Frequency (max) 717 MHz —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Package Type 1152-ball FC-FBGA —
Package Size 35 x 35 mm (1 mm ball pitch) —
Number of Terminals 1152 —
Terminal Form Ball —
Temperature Grade Industrial (-40C to +100C junction) —
Lead-Free Yes —
Status RoHS Compliant [DATA_NEEDED: not in retrieved snippets]
Level MSL [DATA_NEEDED: MSL level] —
Tipe Mounting Surface Mount (BGA) Surface Mount (BGA)
Series — EP2SGX60
Adaptive Logic Modules (ALMs) — 30,220 (estimated from LEs)
Equivalent Logic Cells (CLBs) — 60,440
Embedded Memory (Bits) — 2,544,192 bits (per DigiKey listing for the I4N variant)
Maximum Internal Frequency — 717 MHz
Combinational Delay (per CLB) — 2.99 ns
Multi-Gigabit Transceivers — [DATA_NEEDED: exact count for EP2SGX60]
Maximum Transceiver Data Rate — 6.375 Gbps (per Stratix II GX family spec)
Total RAM Bits — 2,544,192 bits
Paket — 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch
Pin/Ball Count — 1152
Suhu Kerja — -40C to +100C (Industrial, I3 speed grade)
Speed Grade — I3 (Industrial)
Configuration Mode — Enhanced (EPC) - fast parallel via external memory

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