EP3C10F256I7N vs EP3C16F256I7N Perbandingan
Perbandingan bersamaan detil EP3C10F256I7N dari Intel dan EP3C16F256I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C10F256I7N | EP3C16F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Device Type | FPGA | — |
| Logic Elements (LE) | 10,320 | — |
| Logic Blocks | 10,320 | — |
| Embedded Memory | 423,936 bits | 56 M9K blocks (504 Kbit) |
| Total Memory Bits | 423,936 | 516096 |
| Maximum User I/O | 182 | — |
| Embedded 18x18 Multipliers | 46 | 56 |
| PLLs | 2 | 4 |
| Process Technology | 65 nm | TSMC 60 nm low-leakage |
| Core Voltage | 1.2 V | — |
| Paket | 256-LBGA (FineLine BGA) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount | — |
| Suhu Kerja | -40C to +125C (Industrial) | -40C to +100C (industrial, I7) |
| Status RoHS | Compliant | — |
| Lead Free | Yes | — |
| Level MSL | 3 | — |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Maximum User I/O Pins | — | 168 |
| Supply Voltage (Core) | — | 1.2 V typical |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |