EP3C16F484I7 vs EP3C25F324I7 Perbandingan
Perbandingan bersamaan detil EP3C16F484I7 dari Intel dan EP3C25F324I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C16F484I7 | EP3C25F324I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 15,408 | — |
| Logic Array Blocks (LABs) | 963 | 1,539 |
| Total Embedded Memory | 516,096 bits (63 KB) | — |
| Embedded Memory Blocks | M9K x 56 | — |
| Embedded 18x18 Multipliers | 56 | 66 |
| User I/Os | 346 | — |
| General-Purpose PLLs | 4 | — |
| Paket | 484-ball FineLine BGA (F484) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Suhu Kerja | -40C to +100C (industrial) | — |
| Speed Grade | 7 (fastest commercial/industrial) | — |
| Process Node | 60 nm TSMC low-power | — |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount | Surface Mount |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Suhu Hubung Kerja | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |