EP3C16F484I7 vs EP3C25F324I7 比較

詳細並排比較 EP3C16F484I7 由 Intel 與 EP3C25F324I7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C16F484I7 EP3C25F324I7
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 NRND
Family Cyclone III —
Manufacturer Intel (formerly Altera) —
Logic Elements 15,408 —
Logic Array Blocks (LABs) 963 1,539
Total Embedded Memory 516,096 bits (63 KB) —
Embedded Memory Blocks M9K x 56 —
Embedded 18x18 Multipliers 56 66
User I/Os 346 —
General-Purpose PLLs 4 —
封裝 484-ball FineLine BGA (F484) 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
工作溫度 -40C to +100C (industrial) —
Speed Grade 7 (fastest commercial/industrial) —
Process Node 60 nm TSMC low-power —
Configuration Method Passive Serial, Fast Passive Parallel, Active Serial, JTAG —
RoHS 狀態 Compliant Compliant
安裝類型 Surface Mount Surface Mount
Series — Cyclone III
Logic Elements (LEs) — 24,624
Embedded Memory — 608,256 bits (594 Kbits M9K blocks)
PLLs — 4
Global Clock Networks — 20
Maximum User I/O — 215
Process Technology — TSMC 65 nm low-power CMOS
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (per bank)
工作接面溫度 — -40 °C to +100 °C (industrial)
Configuration Modes — Passive Serial (PS), Active Serial (AS), JTAG

資料表與資源

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