EP3C25F324C6N vs EP3C25F324C7N Perbandingan
Perbandingan bersamaan detil EP3C25F324C6N dari Intel dan EP3C25F324C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324C6N | EP3C25F324C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | — |
| Family | Cyclone III (low-power, low-cost FPGA) | — |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | — |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| Paket | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA |
| Speed Grade | C6 (commercial) | — |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Embedded Memory | — | 608,256 bits |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Core Voltage | — | 1.2 V |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |