EP3C40F324I7N vs EP3C25F324I7N Perbandingan
Perbandingan bersamaan detil EP3C40F324I7N dari Intel dan EP3C25F324I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F324I7N | EP3C25F324I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 1,161,216 bits | — |
| Embedded Multipliers (18x18) | 126 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 195 | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Suhu Kerja | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm low-power CMOS (TSMC) | 65 nm |
| Paket | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height | 324-ball FBGA (Fine-Pitch BGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount | — |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory | — | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Speed Grade | — | 7 (slower speed grade, lower power) |
| Lead-Free | — | Yes |
| Level MSL | — | 3 (168 hours) |