EP3C40F324I7N vs EP3C25F324I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C40F324I7N disebabkan oleh Intel dan EP3C25F324I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C40F324I7N | EP3C25F324I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 1,161,216 bits | — |
| Embedded Multipliers (18x18) | 126 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 195 | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Suhu Operasi | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm low-power CMOS (TSMC) | 65 nm |
| Kemasan | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height | 324-ball FBGA (Fine-Pitch BGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount | — |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory | — | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Speed Grade | — | 7 (slower speed grade, lower power) |
| Lead-Free | — | Yes |
| Aras MSL | — | 3 (168 hours) |