EP3C40F324I7N vs EP3C40F324C8N Perbandingan
Perbandingan bersamaan detil EP3C40F324I7N dari Intel dan EP3C40F324C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F324I7N | EP3C40F324C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III (EP3C40) |
| Logic Elements (LE) | 39,600 | 39,600 |
| Logic Array Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 1,161,216 bits | — |
| Embedded Multipliers (18x18) | 126 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 195 | 215 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Suhu Kerja | -40 C to +100 C (Industrial) | 0C to +85C (commercial, C8 suffix) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm low-power CMOS (TSMC) | 60 nm low-power CMOS (TSMC) |
| Paket | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height | FBGA-324 (324-ball FineLine BGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Series | — | Cyclone III |
| Embedded Memory (bits) | — | 1,161,216 (~1.16 Mbit) |
| Embedded 18x18 Multipliers | — | 126 |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Maximum Core Frequency | — | 402 MHz (speed grade 8) |
| Configuration Method | — | SRAM (volatile), requires external boot device |
| Lead-Free | — | Yes |