EP3C40F324I7N vs EP3C40F324C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C40F324I7N disebabkan oleh Intel dan EP3C40F324C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C40F324I7N | EP3C40F324C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III (EP3C40) |
| Logic Elements (LE) | 39,600 | 39,600 |
| Logic Array Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 1,161,216 bits | — |
| Embedded Multipliers (18x18) | 126 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 195 | 215 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Suhu Operasi | -40 C to +100 C (Industrial) | 0C to +85C (commercial, C8 suffix) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm low-power CMOS (TSMC) | 60 nm low-power CMOS (TSMC) |
| Kemasan | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height | FBGA-324 (324-ball FineLine BGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Series | — | Cyclone III |
| Embedded Memory (bits) | — | 1,161,216 (~1.16 Mbit) |
| Embedded 18x18 Multipliers | — | 126 |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Maximum Core Frequency | — | 402 MHz (speed grade 8) |
| Configuration Method | — | SRAM (volatile), requires external boot device |
| Lead-Free | — | Yes |