EP3C40F324I7N vs EP3C40F324C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F324I7N sa pamamagitan ng Intel at EP3C40F324C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F324I7N | EP3C40F324C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III (EP3C40) |
| Logic Elements (LE) | 39,600 | 39,600 |
| Logic Array Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 1,161,216 bits | — |
| Embedded Multipliers (18x18) | 126 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 195 | 215 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Temperature na Operasyon | -40 C to +100 C (Industrial) | 0C to +85C (commercial, C8 suffix) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm low-power CMOS (TSMC) | 60 nm low-power CMOS (TSMC) |
| Packhaging | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height | FBGA-324 (324-ball FineLine BGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Series | — | Cyclone III |
| Embedded Memory (bits) | — | 1,161,216 (~1.16 Mbit) |
| Embedded 18x18 Multipliers | — | 126 |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Maximum Core Frequency | — | 402 MHz (speed grade 8) |
| Configuration Method | — | SRAM (volatile), requires external boot device |
| Lead-Free | — | Yes |