EP3C40F780I8N vs EP3C40F780C7 Perbandingan
Perbandingan bersamaan detil EP3C40F780I8N dari Intel dan EP3C40F780C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F780I8N | EP3C40F780C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone III | Cyclone III |
| Device Logic Elements | 39,600 | — |
| Logic Array Blocks (LABs/CLBs) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Memory (Kbits) | 1,134 | — |
| Embedded Multipliers (18x18) | 126 | — |
| Number of PLLs | 4 | 4 |
| User I/O Pins | 535 | — |
| I/O Banks | 20 | 8 |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| Paket | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Package Ball Pitch | 1.0 mm | — |
| Process Technology | TSMC 65 nm low-power CMOS | 60 nm TSMC low-power CMOS |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) | — |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | — |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 | 3 (168 hours) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Logic Elements (LE) | — | 39,600 |
| Number of Logic Cells | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Embedded 18x18 Multipliers | — | 126 |
| User I/O Count | — | 535 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Speed Grade | — | C7 |
| Configuration | — | Active Serial / Passive Parallel (JTAG) |