EP3C40F780I8N vs EP3C40F780C7 比較
詳細並排比較 EP3C40F780I8N 由 Intel 與 EP3C40F780C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C40F780I8N | EP3C40F780C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Family | Cyclone III | Cyclone III |
| Device Logic Elements | 39,600 | — |
| Logic Array Blocks (LABs/CLBs) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Memory (Kbits) | 1,134 | — |
| Embedded Multipliers (18x18) | 126 | — |
| Number of PLLs | 4 | 4 |
| User I/O Pins | 535 | — |
| I/O Banks | 20 | 8 |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| 封裝 | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Package Ball Pitch | 1.0 mm | — |
| Process Technology | TSMC 65 nm low-power CMOS | 60 nm TSMC low-power CMOS |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) | — |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | — |
| RoHS 狀態 | Compliant | Compliant |
| MSL 等級 | 3 | 3 (168 hours) |
| 安裝類型 | Surface Mount (BGA) | — |
| Logic Elements (LE) | — | 39,600 |
| Number of Logic Cells | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Embedded 18x18 Multipliers | — | 126 |
| User I/O Count | — | 535 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| 工作溫度 | — | 0C to +85C (Commercial) |
| Speed Grade | — | C7 |
| Configuration | — | Active Serial / Passive Parallel (JTAG) |