EP3C40F780I8N vs EP3C40F780C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780I8N sa pamamagitan ng Intel at EP3C40F780C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F780I8N | EP3C40F780C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone III | Cyclone III |
| Device Logic Elements | 39,600 | — |
| Logic Array Blocks (LABs/CLBs) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Memory (Kbits) | 1,134 | — |
| Embedded Multipliers (18x18) | 126 | — |
| Number of PLLs | 4 | 4 |
| User I/O Pins | 535 | — |
| I/O Banks | 20 | 8 |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| Packhaging | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Package Ball Pitch | 1.0 mm | — |
| Process Technology | TSMC 65 nm low-power CMOS | 60 nm TSMC low-power CMOS |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) | — |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | 3 (168 hours) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Logic Elements (LE) | — | 39,600 |
| Number of Logic Cells | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Embedded 18x18 Multipliers | — | 126 |
| User I/O Count | — | 535 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Speed Grade | — | C7 |
| Configuration | — | Active Serial / Passive Parallel (JTAG) |