EP3C40F780I8N vs EP3C40F780C7N Perbandingan
Perbandingan bersamaan detil EP3C40F780I8N dari Intel dan EP3C40F780C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F780I8N | EP3C40F780C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Device Logic Elements | 39,600 | — |
| Logic Array Blocks (LABs/CLBs) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Memory (Kbits) | 1,134 | — |
| Embedded Multipliers (18x18) | 126 | — |
| Number of PLLs | 4 | — |
| User I/O Pins | 535 | — |
| I/O Banks | 20 | — |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| Paket | 780-ball FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Package Ball Pitch | 1.0 mm | — |
| Process Technology | TSMC 65 nm low-power CMOS | — |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) | — |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | — |
| Status RoHS | Compliant | — |
| Level MSL | 3 | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Logic Elements | — | 39,600 LE |
| Total RAM Bits | — | 1,161,216 bits |
| Embedded Multipliers | — | 126 (18x18) |
| User I/Os | — | 535 |
| Speed Grade | — | 7 (C7, commercial) |
| Process Node | — | 65 nm TSMC low-power |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Supply Voltage (Core) | — | 1.2 V |
| Configuration Method | — | JTAG, Active Serial, Passive Serial |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Moisture Sensitivity Level | — | MSL3 (per J-STD-020) |