EP3C40F780I8N vs EP3C40F780C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780I8N sa pamamagitan ng Intel at EP3C40F780C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F780I8N | EP3C40F780C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Device Logic Elements | 39,600 | — |
| Logic Array Blocks (LABs/CLBs) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Memory (Kbits) | 1,134 | — |
| Embedded Multipliers (18x18) | 126 | — |
| Number of PLLs | 4 | — |
| User I/O Pins | 535 | — |
| I/O Banks | 20 | — |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| Packhaging | 780-ball FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Package Ball Pitch | 1.0 mm | — |
| Process Technology | TSMC 65 nm low-power CMOS | — |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) | — |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | — |
| Tindminan RoHS | Compliant | — |
| Level ng MSL | 3 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Logic Elements | — | 39,600 LE |
| Total RAM Bits | — | 1,161,216 bits |
| Embedded Multipliers | — | 126 (18x18) |
| User I/Os | — | 535 |
| Speed Grade | — | 7 (C7, commercial) |
| Process Node | — | 65 nm TSMC low-power |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Supply Voltage (Core) | — | 1.2 V |
| Configuration Method | — | JTAG, Active Serial, Passive Serial |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Moisture Sensitivity Level | — | MSL3 (per J-STD-020) |