EP3C55F484C8 vs EP3C55F484C7 Perbandingan
Perbandingan bersamaan detil EP3C55F484C8 dari Intel dan EP3C55F484C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484C8 | EP3C55F484C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Device Family | Cyclone® III | Cyclone III |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | 3,495 |
| Embedded Memory Bits | 2,396,160 bits | 2,396,160 bits |
| Embedded 18x18 Multipliers | 312 | 156 |
| User I/Os | 327 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Maximum Core Frequency | 472.5 MHz | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-k CMOS |
| Paket | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) |
| Speed Grade | C8 (commercial, -8) | — |
| Suhu Kerja | Commercial (0C to +85C) | — |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | — |
| Lead-Free / RoHS | Yes (Pb-free FBGA) | — |
| Tegangan Pemuat | Core 1.2 V typical, I/O bank dependent | — |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory (M9K blocks) | — | 260 blocks of 9 Kbit each |
| Maximum User I/Os | — | 327 |
| Internal Operating Frequency (max) | — | 472 MHz |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0 °C to +85 °C) - C7 speed grade |
| Tipe Mounting | — | Surface Mount (BGA) |
| Status RoHS | — | Compliant (lead-free FBGA) |
| Configuration Mode | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Configuration Memory Type | — | SRAM (volatile, requires external flash) |