EP3C5F256C6 vs EP3C16F256I7N Perbandingan
Perbandingan bersamaan detil EP3C5F256C6 dari Intel dan EP3C16F256I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C5F256C6 | EP3C16F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | 963 |
| Total Memory Bits | 423,936 bits | 516096 |
| Embedded Memory | M9K blocks (per Cyclone III family) | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | 23 | 56 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 65 nm CMOS, low-k | TSMC 60 nm low-leakage |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Paket | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount | — |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| Status RoHS | Compliant (lead-free per FBGA package) | — |
| Logic Elements (LEs) | — | 15408 |
| Maximum User I/O Pins | — | 168 |
| Suhu Kerja | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |