EP3C5F256C6 vs EP3C16F256I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256C6 sa pamamagitan ng Intel at EP3C16F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256C6 | EP3C16F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | 963 |
| Total Memory Bits | 423,936 bits | 516096 |
| Embedded Memory | M9K blocks (per Cyclone III family) | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | 23 | 56 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 65 nm CMOS, low-k | TSMC 60 nm low-leakage |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Packhaging | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | — |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| Tindminan RoHS | Compliant (lead-free per FBGA package) | — |
| Logic Elements (LEs) | — | 15408 |
| Maximum User I/O Pins | — | 168 |
| Temperature na Operasyon | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |