EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
MPN: EP3C5U256C6N ✓ AktifEP3C5U256C6N Ringkasan
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic.
Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes.
The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources.
Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment.
When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.
Alternatif penggantian untuk EP3C5U256C6N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP3C5U256C6N (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Speed Grade, Package, Configuration Modes, Operating Temperature.
EP3C5U256C6
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C5U256A7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C10U256C6N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP3C16U256C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C25U256I7N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP3C5U256C6N Rating Maksimal & Karakteristik Listrik
| Series | Cyclone III |
| Device Family | Cyclone III FPGA |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Memory | 423,936 bits |
| Maximum User I/Os | 182 |
| Paket | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 14 x 14 mm |
| Ball Pitch | 0.80 mm |
| Package Height | 2.20 mm |
| Speed Grade | C6 |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 60 nm low-power CMOS |
| Tipe Mounting | Surface Mount (BGA) |
| Lead Free / RoHS | Yes / Compliant |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
Konfigurasi Pin EP3C5U256C6N
| Pin produk A1 | I/O — User I/O (bank 1) |
| Pin produk A2 | I/O — User I/O (bank 1) |
| Pin produk A3 | I/O — User I/O (bank 1) |
| Pin produk A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk A5 | I/O — User I/O (bank 1) |
| Pin produk A6 | I/O — User I/O (bank 1) |
| Pin produk A7 | I/O — User I/O (bank 1) |
| Pin produk A8 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk B1 | I/O — User I/O (bank 1) |
| Pin produk B2 | GND — Ground |
| Pin produk B3 | I/O — User I/O (bank 1) |
| Pin produk B4 | I/O — User I/O (bank 1) |
| Pin produk B5 | GND — Ground |
| Pin produk B6 | I/O — User I/O (bank 1) |
| Pin produk B7 | I/O — User I/O (bank 1) |
| Pin produk B8 | GND — Ground |
| Pin produk C1 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk C2 | I/O — User I/O (bank 2) |
| Pin produk C3 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk C4 | I/O — User I/O (bank 2) |
| Pin produk C5 | I/O — User I/O (bank 2) |
| Pin produk C6 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk C7 | I/O — User I/O (bank 2) |
| Pin produk C8 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk D1 | I/O — User I/O (bank 2) |
| Pin produk D2 | GND — Ground |
| Pin produk D3 | I/O — User I/O (bank 2) |
| Pin produk D4 | TCK — JTAG Test Clock |
| Pin produk D5 | TDO — JTAG Test Data Out |
| Pin produk D6 | I/O — User I/O (bank 2) |
| Pin produk D7 | GND — Ground |
| Pin produk D8 | I/O — User I/O (bank 2) |
| Pin produk E1 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk E2 | I/O — User I/O (bank 3) |
| Pin produk E3 | I/O — User I/O (bank 3) |
| Pin produk E4 | TMS — JTAG Test Mode Select |
| Pin produk E5 | TDI — JTAG Test Data In |
| Pin produk E6 | I/O — User I/O (bank 3) |
| Pin produk E7 | I/O — User I/O (bank 3) |
| Pin produk E8 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk F1 | I/O — User I/O (bank 3) |
| Pin produk F2 | GND — Ground |
| Pin produk F3 | I/O — User I/O (bank 3) |
| Pin produk F4 | I/O — User I/O (bank 3) |
| Pin produk F5 | nCONFIG — Configuration control (active low) |
| Pin produk F6 | GND — Ground |
| Pin produk F7 | I/O — User I/O (bank 3) |
| Pin produk F8 | I/O — User I/O (bank 3) |
| Pin produk G1 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk G2 | I/O — User I/O (bank 4) |
| Pin produk G3 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk G4 | CONF_DONE — Configuration done status (open-drain) |
| Pin produk G5 | nSTATUS — Configuration status (open-drain) |
| Pin produk G6 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk G7 | I/O — User I/O (bank 4) |
| Pin produk G8 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk H1 | I/O — User I/O (bank 4) |
| Pin produk H2 | GND — Ground |
| Pin produk H3 | I/O — User I/O (bank 4) |
| Pin produk H4 | I/O — User I/O (bank 4) |
| Pin produk H5 | GND — Ground |
| Pin produk H6 | I/O — User I/O (bank 4) |
| Pin produk H7 | I/O — User I/O (bank 4) |
| Pin produk H8 | GND — Ground |
| Pin produk J1 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk J2 | I/O — User I/O (bank 5) |
| Pin produk J3 | I/O — User I/O (bank 5) |
| Pin produk J4 | CLK0 — Clock input 0 (dedicated) |
| Pin produk J5 | CLK1 — Clock input 1 (dedicated) |
| Pin produk J6 | I/O — User I/O (bank 5) |
| Pin produk J7 | I/O — User I/O (bank 5) |
| Pin produk J8 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk K1 | I/O — User I/O (bank 5) |
| Pin produk K2 | GND — Ground |
| Pin produk K3 | I/O — User I/O (bank 5) |
| Pin produk K4 | I/O — User I/O (bank 5) |
| Pin produk K5 | GND — Ground |
| Pin produk K6 | I/O — User I/O (bank 5) |
| Pin produk K7 | GND — Ground |
| Pin produk K8 | I/O — User I/O (bank 5) |
| Pin produk L1 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk L2 | I/O — User I/O (bank 6) |
| Pin produk L3 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk L4 | I/O — User I/O (bank 6) |
| Pin produk L5 | I/O — User I/O (bank 6) |
| Pin produk L6 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk L7 | I/O — User I/O (bank 6) |
| Pin produk L8 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk M1 | I/O — User I/O (bank 6) |
| Pin produk M2 | GND — Ground |
| Pin produk M3 | I/O — User I/O (bank 6) |
| Pin produk M4 | I/O — User I/O (bank 6) |
| Pin produk M5 | GND — Ground |
| Pin produk M6 | I/O — User I/O (bank 6) |
| Pin produk M7 | I/O — User I/O (bank 6) |
| Pin produk M8 | GND — Ground |
| Pin produk N1 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk N2 | I/O — User I/O (bank 7) |
| Pin produk N3 | I/O — User I/O (bank 7) |
| Pin produk N4 | I/O — User I/O (bank 7) |
| Pin produk N5 | I/O — User I/O (bank 7) |
| Pin produk N6 | I/O — User I/O (bank 7) |
| Pin produk N7 | I/O — User I/O (bank 7) |
| Pin produk N8 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk P1 | I/O — User I/O (bank 7) |
| Pin produk P2 | GND — Ground |
| Pin produk P3 | I/O — User I/O (bank 7) |
| Pin produk P4 | I/O — User I/O (bank 8) |
| Pin produk P5 | GND — Ground |
| Pin produk P6 | I/O — User I/O (bank 8) |
| Pin produk P7 | I/O — User I/O (bank 8) |
| Pin produk P8 | GND — Ground |
| Pin produk R1 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk R2 | I/O — User I/O (bank 8) |
| Pin produk R3 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk R4 | I/O — User I/O (bank 8) |
| Pin produk R5 | I/O — User I/O (bank 8) |
| Pin produk R6 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk R7 | I/O — User I/O (bank 8) |
| Pin produk R8 | VCCINT — Core logic supply voltage (1.2V) |
| Pin produk T1 | I/O — User I/O (bank 8) |
| Pin produk T2 | GND — Ground |
| Pin produk T3 | I/O — User I/O (bank 8) |
| Pin produk T4 | I/O — User I/O (bank 8) |
| Pin produk T5 | GND — Ground |
| Pin produk T6 | I/O — User I/O (bank 8) |
| Pin produk T7 | I/O — User I/O (bank 8) |
| Pin produk T8 | GND — Ground |
| Pin produk U1 | DATA0 — Configuration data (AS/PS mode) |
| Pin produk U2 | I/O — User I/O (bank 8) |
| Pin produk U3 | I/O — User I/O (bank 8) |
| Pin produk U4 | MSEL0 — Configuration mode select 0 |
| Pin produk U5 | MSEL1 — Configuration mode select 1 |
| Pin produk U6 | I/O — User I/O (bank 8) |
| Pin produk U7 | I/O — User I/O (bank 8) |
| Pin produk U8 | DCLK — Configuration clock input |
| Pin produk V1 | I/O — User I/O (bank 8) |
| Pin produk V2 | GND — Ground |
| Pin produk V3 | I/O — User I/O (bank 8) |
| Pin produk V4 | I/O — User I/O (bank 8) |
| Pin produk V5 | GND — Ground |
| Pin produk V6 | I/O — User I/O (bank 8) |
| Pin produk V7 | GND — Ground |
| Pin produk V8 | I/O — User I/O (bank 8) |
| Pin produk W1 | VCCA_PLL1 — PLL1 analog supply (2.5V) |
| Pin produk W2 | I/O — User I/O (bank 8) |
| Pin produk W3 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk W4 | I/O — User I/O (bank 8) |
| Pin produk W5 | nCE — Chip enable (active low) |
| Pin produk W6 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk W7 | I/O — User I/O (bank 8) |
| Pin produk W8 | GNDA_PLL1 — PLL1 analog ground |
| Pin produk Y1 | I/O — User I/O (bank 8) |
| Pin produk Y2 | GND — Ground |
| Pin produk Y3 | I/O — User I/O (bank 8) |
| Pin produk Y4 | I/O — User I/O (bank 8) |
| Pin produk Y5 | GND — Ground |
| Pin produk Y6 | I/O — User I/O (bank 8) |
| Pin produk Y7 | I/O — User I/O (bank 8) |
| Pin produk Y8 | GND — Ground |
Aplikasi Umum
EP3C5U256C6N cocok untuk 6 aplikasis: Industrial Motor Control, Video Surveillance / Display Bridging, Telecommunications Line Card Glue Logic, Low-Cost ASIC Replacement, USB and Connectivity Bridging, Embedded Control Logic in Factory Automation.
Industrial Motor Control
The EP3C5U256C6N is well-suited for industrial motor control applications where precise timing and flexible I/O configuration are essential. Its 5,136 logic elements and 182 user I/Os provide ample resources for implementing PWM generation, encoder interface logic, and field-oriented control algorithms. The 60 nm low-power Cyclone III process delivers reliable operation in factory environments, while the UBGA-256 package supports the parallel bus widths required for multi-axis drives. Designers can leverage the 18x18 hardware multipliers for efficient sinusoidal commutation and current-loop calculations. Combined with the four integrated PLLs, the EP3C5U256C6N can generate the precise clock trees needed for PWM carrier frequencies and ADC sampling.
Direkomendasikan
Video Surveillance / Display Bridging
The EP3C5U256C6N excels in video bridging applications where camera sensors, displays, and processors must be interconnected with format conversion and timing adjustment. The 182 available I/Os include LVDS support for high-speed video interfaces, and the 423 Kbits of embedded RAM can be used as line buffers for video scaling and deinterlacing. Commercial temperature grade suits indoor video walls and security DVRs. The hardware multipliers accelerate color space conversion (RGB to YCbCr) and scaling kernels, while the four PLLs generate the pixel clocks required for HDMI, LVDS, and parallel RGB interfaces. Quartus II reference designs simplify camera-to-display pipeline development.
Direkomendasikan
Telecommunications Line Card Glue Logic
Telecommunications line cards require programmable glue logic to interface between SERDES, network processors, and backplane connectors, and the EP3C5U256C6N fits this role with its 182 LVCMOS/LVDS/SSTL I/Os. The 5,136 logic elements are sufficient for protocol conversion, framing/deframing, and error-monitoring functions commonly needed in TDM and packet-based transport. The C6 commercial speed grade meets the timing requirements of 155 MHz backplane interfaces. Multiple I/O banks support mixed voltage standards (1.5V, 1.8V, 2.5V, 3.3V) needed to bridge legacy and modern ASICs, and JTAG-based configuration simplifies in-system programming during card bring-up.
Direkomendasikan
Low-Cost ASIC Replacement
The EP3C5U256C6N is widely used as a low-cost ASIC replacement for medium-complexity glue logic, state machines, and protocol bridges where ASIC NRE is unjustified. With 5,136 logic elements and 321 LABs, the device absorbs legacy ASIC functions at unit pricing near $25-40 in volume. Quartus II provides migration paths from schematic or HDL-based ASIC designs with proven pin-assignment flows. Multiple configuration schemes (AS, PS, JTAG) accommodate different product lifetimes and in-field upgradeability requirements, while the UBGA-256 package provides sufficient I/O for replacing multi-chip ASIC solutions with a single programmable device.
Direkomendasikan
USB and Connectivity Bridging
Embedded systems often require bridging between USB, UART, SPI, I2C, and parallel buses, and the EP3C5U256C6N provides sufficient logic and I/O to act as a flexible connectivity bridge. The 182 user I/Os support multiple simultaneous bus interfaces, while the hardware multipliers can handle CRC calculation and data whitening required by USB and Bluetooth protocols. Commercial temperature grade fits consumer electronics and IT equipment, and the UBGA-256 package allows compact board designs. Designers can leverage Quartus reference designs for USB 2.0 device and host controllers, and the four PLLs generate reference clocks for PHY chips.
Direkomendasikan
Embedded Control Logic in Factory Automation
Factory automation equipment requires deterministic control logic for sensor aggregation, actuator control, and safety interlocks, and the EP3C5U256C6N delivers these functions in a single chip. Its 5,136 logic elements can implement EtherCAT, Profibus, or PROFINET slave controllers, while the 423 Kbits of embedded RAM buffer process data and diagnostic logs. Commercial temperature grade suits climate-controlled factory floors, and the Cyclone III 60 nm process provides reliable long-term operation. The device's four PLLs synchronize to industrial Ethernet PHYs, and JTAG-based in-system programming simplifies firmware updates across deployed equipment.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP3C5U256C6N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP3C5U256C6 | EP3C5U256A7N | EP3C10U256C6N | EP3C16U256C8N | EP3C25U256I7N |
|---|---|---|---|---|---|---|
| Package | 256-UBGA (14x14 mm, 0.80 mm pitch) | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Speed Grade | C6 | C6 | A7 (faster) | C6 | C8 (slower) | I7 (industrial) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits | 608,256 bits |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes (Pb-free) | No (Pb-containing) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Diferensiator Kunci
- Lowest-density Cyclone III in UBGA-256 footprint with C6 speed grade (vsEP3C10U256C6N)
- C6 commercial speed grade optimized for cost-sensitive designs (vsEP3C5U256A7N)
- Commercial temperature grade with RoHS-compliant Pb-free ball finish (vsEP3C25U256I7N)
Catatan Desain
The EP3C5U256C6N requires three supply rails: VCCINT (1.2V core), VCCIOx (per-bank I/O supply, 1.5V-3.3V depending on standards), and VCCA_PLLx (2.5V analog supply for each PLL). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10-100 uF tantalum or ceramic capacitors at each supply plane. PLL analog supplies should be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF to minimize jitter. Estimated core current at 100 MHz toggle activity is ~150 mA, rising with logic utilization and clock frequency.
The 256-ball UBGA package uses 0.80 mm ball pitch requiring microvia or via-in-pad PCB technology for reliable assembly. Escape routing on inner layers should use 0.4-0.5 mm trace/space and 8-12 mil laser-drilled microvias. Stencil aperture of 1:1 with 4-5 mil reduction produces consistent solder joints. Per IPC-7093, BGA packages require X-ray inspection after reflow and BGA rework capability is recommended for prototype builds.
Differential pairs (LVDS) require 100 ohm differential impedance with matched trace lengths within 20 mil. CLK0/CLK1 dedicated clock inputs should be routed with controlled impedance and isolated from switching signals. Use full ground planes on all layers adjacent to BGA breakout traces; avoid power plane splits beneath the device. JTAG chain (TCK, TMS, TDI, TDO) should be kept short and protected with series termination if chain length exceeds 4 inches.
Configuration mode pins (MSEL0, MSEL1, MSEL2) must match the desired configuration scheme - incorrect MSEL settings cause configuration failure. nCONFIG must see a clean rising edge with appropriate RC time constant (typically 1k resistor + 0.1 uF cap). CONF_DONE and nSTATUS are open-drain and require external 10k pull-ups to VCCIO. Do not leave JTAG pins floating during normal operation if JTAG is unused - tie TCK low and TMS high per IEEE 1149.1.
Informasi Konformitas
RoHS and REACH compliant per Cyclone III product family documentation. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for commercial-grade FPGAs. Conflict-minerals compliance per Intel program-level disclosures.
