EP3CLS100F484C8N vs EP3CLS100F484I7 Perbandingan

Perbandingan bersamaan detil EP3CLS100F484C8N dari Intel dan EP3CLS100F484I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3CLS100F484C8N EP3CLS100F484I7
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Cyclone® III LS —
Family Name Cyclone III LS —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits —
Number of I/O 278 (maximum user I/O) —
Number of Logic Blocks / Cells 47 (logic blocks reported by DigChip snapshot) —
Package Type FBGA-484 (FineLine BGA, lead-free) —
Pin / Ball Count 484 —
Supply Voltage (Core) 1.2 V —
Speed Grade C8 (commercial, fastest) —
Process Technology TSMC 65 nm low-power (LP) TSMC 65 nm low-power (LP)
Suhu Kerja 0°C to +85°C (commercial grade) —
Tipe Mounting Surface Mount —
Configuration Interface JTAG, Passive Serial, Active Serial —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
Status RoHS Compliant (Pb-free, 'N' suffix) Compliant
Level MSL 3 (per JEDEC J-STD-020, typical for BGA) —
Embedded Multipliers (18x18) 4,488 (per Cyclone III LS family handbook, 100K LE tier) —
PLLs 4 (per Cyclone III LS family) 4
DSP Blocks Integrated (multiplier-based) —
Device Family — Cyclone III LS
Logic Elements (LE) — 100,448
Logic Array Blocks (LABs) — 278
Total Embedded Memory Bits — 4,451,328 bits
Embedded Memory (M9K Blocks) — 610 (per datasheet family)
DSP Blocks (18x18 Multipliers) — 66
18x18 Hardware Multipliers — 16 dedicated
Maximum User I/Os — 429
Paket — 484-ball FBGA (FineLine BGA)
Core Supply Voltage — 1.2 V
I/O Standards Supported — LVDS, LVCMOS, LVTTL, SSTL, HSTL
Rentang Suhu Kerja — -40C to +85C (Industrial)
Configuration Method — Serial/Parallel, AES-256 encrypted (LS feature)
External Memory Support — DDR, DDR2, QDRII, RLDRAM II

Spek dan Sumber

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