EP3CLS100F484C8N vs EP3CLS100F484I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F484C8N sa pamamagitan ng Intel at EP3CLS100F484I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS100F484C8N | EP3CLS100F484I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | — |
| Process Technology | TSMC 65 nm low-power (LP) | TSMC 65 nm low-power (LP) |
| Temperature na Operasyon | 0°C to +85°C (commercial grade) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| Tindminan RoHS | Compliant (Pb-free, 'N' suffix) | Compliant |
| Level ng MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | — |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 4,451,328 bits |
| Embedded Memory (M9K Blocks) | — | 610 (per datasheet family) |
| DSP Blocks (18x18 Multipliers) | — | 66 |
| 18x18 Hardware Multipliers | — | 16 dedicated |
| Maximum User I/Os | — | 429 |
| Packhaging | — | 484-ball FBGA (FineLine BGA) |
| Core Supply Voltage | — | 1.2 V |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Hanay ng Temperature na Operasyon | — | -40C to +85C (Industrial) |
| Configuration Method | — | Serial/Parallel, AES-256 encrypted (LS feature) |
| External Memory Support | — | DDR, DDR2, QDRII, RLDRAM II |