EP3CLS200F484C8 vs EP3CLS70F484C8 Perbandingan
Perbandingan bersamaan detil EP3CLS200F484C8 dari Intel dan EP3CLS70F484C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS200F484C8 | EP3CLS70F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | — |
| Family | Cyclone III LS (low-power Cyclone III) | Cyclone III LS |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 20,5056 (approx) | — |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | — |
| Embedded 18x18 Multipliers | 210 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power |
| Paket | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Security | Design encryption / bitstream AES | — |
| Suhu Kerja | 0C to +85C (commercial, 'C' suffix) | — |
| Tipe Mounting | Surface Mount | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 70,208 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 3,068,928 |
| Embedded Memory Blocks | — | M9K (4 Kbit each) |
| Embedded Multipliers (18x18) | — | 300 |
| Maximum User I/O Pins | — | 278 |
| Global Clock Networks | — | 20 |
| Core Supply Voltage | — | 1.2 V |
| Suhu Hubung Kerja | — | 0C to +85C (commercial) |
| Bitstream Encryption | — | AES-256 (Cyclone III LS feature) |
| Configuration Mode | — | Active serial, passive serial, JTAG, fast passive parallel |
| Lead-Free | — | Yes |