EP3SE260F1152C2N vs EP3SE260F1152C4 Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C2N dari Intel dan EP3SE260F1152C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C2N EP3SE260F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Series Stratix III E Stratix III E (Enhanced)
Family FPGA - Field Programmable Gate Array Stratix III
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Tipe Mounting Surface Mount Surface Mount (BGA)
Suhu Kerja [DATA_NEEDED: operating temperature grade] Commercial (0C to +85C) - inferred from speed grade C4
Paket / Case 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm CMOS (TSMC)
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
Level MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant Compliant (per distributor listings)
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements (LE) — 255,000
Logic Array Blocks (LABs) — 10,200
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Core Voltage — 1.1 V
Speed Grade — C4 (slowest commercial grade)
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Paket — 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

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