EP3SE260F1152C2N vs EP3SE260F1152C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2N sa pamamagitan ng Intel at EP3SE260F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C2N EP3SE260F1152C4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Series Stratix III E Stratix III E (Enhanced)
Family FPGA - Field Programmable Gate Array Stratix III
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Temperature na Operasyon [DATA_NEEDED: operating temperature grade] Commercial (0C to +85C) - inferred from speed grade C4
Packhaging / Kaso 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm CMOS (TSMC)
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant Compliant (per distributor listings)
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements (LE) — 255,000
Logic Array Blocks (LABs) — 10,200
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Core Voltage — 1.1 V
Speed Grade — C4 (slowest commercial grade)
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Packhaging — 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

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