EP3SE260F1152C4 vs EP3SE260F1152C2G Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C4 dari Intel dan EP3SE260F1152C2G dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C4 EP3SE260F1152C2G
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Series Stratix III E (Enhanced) EP3SE260
Family Stratix III Stratix III E
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 —
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) —
Core Voltage 1.1 V 1.1 V
Speed Grade C4 (slowest commercial grade) C2 (commercial)
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
Paket 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-BBGA, FCBGA (FineLine BGA)
Package Code BGA, square BGA (Ball Grid Array)
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
Status RoHS Compliant (per distributor listings) Compliant (G suffix)
Suhu Kerja Commercial (0C to +85C) - inferred from speed grade C4 —
Tipe Mounting Surface Mount (BGA) Surface Mount
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Shape — Square
Technology / Process Node — 65 nm
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon