EP3SE260F1152C4 vs EP3SE260F1152C2G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4 sa pamamagitan ng Intel at EP3SE260F1152C2G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C4 EP3SE260F1152C2G
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Series Stratix III E (Enhanced) EP3SE260
Family Stratix III Stratix III E
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 —
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) —
Core Voltage 1.1 V 1.1 V
Speed Grade C4 (slowest commercial grade) C2 (commercial)
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
Packhaging 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-BBGA, FCBGA (FineLine BGA)
Package Code BGA, square BGA (Ball Grid Array)
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
Tindminan RoHS Compliant (per distributor listings) Compliant (G suffix)
Temperature na Operasyon Commercial (0C to +85C) - inferred from speed grade C4 —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Shape — Square
Technology / Process Node — 65 nm
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray

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