EP3SE260F1152C4 vs EP3SE260F1152C2G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4 disebabkan oleh Intel dan EP3SE260F1152C2G disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260F1152C4 EP3SE260F1152C2G
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Series Stratix III E (Enhanced) EP3SE260
Family Stratix III Stratix III E
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 —
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) —
Core Voltage 1.1 V 1.1 V
Speed Grade C4 (slowest commercial grade) C2 (commercial)
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
Kemasan 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-BBGA, FCBGA (FineLine BGA)
Package Code BGA, square BGA (Ball Grid Array)
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
Status RoHS Compliant (per distributor listings) Compliant (G suffix)
Suhu Operasi Commercial (0C to +85C) - inferred from speed grade C4 —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Shape — Square
Technology / Process Node — 65 nm
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray

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