EP3SE260F1152I3 vs EP3SE260F1152I3G Perbandingan

Perbandingan bersamaan detil EP3SE260F1152I3 dari Intel dan EP3SE260F1152I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152I3 EP3SE260F1152I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Series Stratix III E (EP3SE260) Stratix III E
Logic Elements 255,000 —
Number of LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 —
User I/O Count 744 744
Number of Embedded Multipliers (DSP blocks) 768 —
Core Voltage 1.1 V —
Suhu Kerja -40C to +100C (Industrial) —
Process Technology 65 nm 40 nm TSMC low-power
Maximum Fabric Frequency 500 MHz —
Paket 1152-BBGA, FC-FBGA (Flip-Chip) 1152-BBGA, FCBGA (FineLine BGA)
Tipe Mounting Surface Mount Surface Mount (BGA)
Speed Grade I3 (Industrial, speed bin 3) I3 (Industrial, balanced)
Level MSL [DATA_NEEDED: MSL level] —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance not stated in scraped data]
Product Status Obsolete (per Xecor comparator) —
Family — Stratix III
Logic Elements (LE) — 255,000
Embedded Memory Bits — 16,672,640 bits
Embedded Memory Bits (alternate) — 20,880 Kb (16,672,640 / 1024)
Rentang Suhu Kerja — -40C to +100C (Industrial)
Supply Voltage Core — 0.9 V (typical, see handbook)
Configuration Bitstream Encryption — AES-256 (Stratix III feature)
I/O Standards Supported — LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X
Tingkat Sensitivitas Kekeringan (MSL) — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]
Lead-Free Reflow — [DATA_NEEDED: peak reflow temperature]
Design Toolchain — Quartus II / Quartus Prime
Country of Origin / Distribution — Multiple authorized distributors (DigiKey, Mouser)

Spek dan Sumber

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