EP3SE260F1152I3 vs EP3SE260F1152I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I3 disebabkan oleh Intel dan EP3SE260F1152I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260F1152I3 EP3SE260F1152I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Series Stratix III E (EP3SE260) Stratix III E
Logic Elements 255,000 —
Number of LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 —
User I/O Count 744 744
Number of Embedded Multipliers (DSP blocks) 768 —
Core Voltage 1.1 V —
Suhu Operasi -40C to +100C (Industrial) —
Process Technology 65 nm 40 nm TSMC low-power
Maximum Fabric Frequency 500 MHz —
Kemasan 1152-BBGA, FC-FBGA (Flip-Chip) 1152-BBGA, FCBGA (FineLine BGA)
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Speed Grade I3 (Industrial, speed bin 3) I3 (Industrial, balanced)
Aras MSL [DATA_NEEDED: MSL level] —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance not stated in scraped data]
Product Status Obsolete (per Xecor comparator) —
Family — Stratix III
Logic Elements (LE) — 255,000
Embedded Memory Bits — 16,672,640 bits
Embedded Memory Bits (alternate) — 20,880 Kb (16,672,640 / 1024)
Gambaran Suhu Operasi — -40C to +100C (Industrial)
Supply Voltage Core — 0.9 V (typical, see handbook)
Configuration Bitstream Encryption — AES-256 (Stratix III feature)
I/O Standards Supported — LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X
Tingkat sensitiviti Air Nama (MSL) — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]
Lead-Free Reflow — [DATA_NEEDED: peak reflow temperature]
Design Toolchain — Quartus II / Quartus Prime
Country of Origin / Distribution — Multiple authorized distributors (DigiKey, Mouser)

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