EP3SE260F1152I3N vs EP3SE260F1152C4N Perbandingan

Perbandingan bersamaan detil EP3SE260F1152I3N dari Intel dan EP3SE260F1152C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152I3N EP3SE260F1152C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Obsolete
Series Stratix III E Stratix III E
Family Name Stratix III E —
Logic Elements / Cells 255000 —
Logic Array Blocks (LABs) 10200 —
Total RAM Bits 16672768 —
Number of I/Os 744 —
Number of Gates [DATA_NEEDED: number of gates] —
Core Voltage 0.9 V to 1.1 V selectable 1.1 V
Suhu Kerja -40C to +100C (industrial) 0C to +85C (commercial, 'C' suffix)
Tipe Mounting Surface Mount Surface Mount (BGA)
Paket / Case 1152-BBGA, FCBGA (FC-FBGA) —
Process Technology 65 nm CMOS 65 nm CMOS
Max Internal Frequency 500 MHz —
Supplier Temperature Grade Industrial —
Status RoHS [DATA_NEEDED: RoHS status] —
Level MSL [DATA_NEEDED: MSL level] —
Family — Stratix III (Enhanced)
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Maximum Operating Frequency — 450 MHz
Paket — 1152-ball FC-FBGA (flip-chip)
Speed Grade — -4 (commercial temperature)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Tipe Memori — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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