EP3SE260F1517I3 vs EP3SE260F1517C3 Perbandingan
Perbandingan bersamaan detil EP3SE260F1517I3 dari Intel dan EP3SE260F1517C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517I3 | EP3SE260F1517C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | — |
| Paket | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FineLine BGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | Commercial (C suffix) |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 0.9 V |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Status RoHS | Compliant | Compliant |
| Configuration | SRAM-based, volatile (requires external configuration device) | SRAM-based, requires external configuration device |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm (TSMC) |
| Package Pitch | — | 1.0 mm |
| Speed Grade | — | 3 |