EP3SE260F1517I3 vs EP3SE260F1517C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3 sa pamamagitan ng Intel at EP3SE260F1517C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I3 | EP3SE260F1517C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | Commercial (C suffix) |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 0.9 V |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Tindminan RoHS | Compliant | Compliant |
| Configuration | SRAM-based, volatile (requires external configuration device) | SRAM-based, requires external configuration device |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm (TSMC) |
| Package Pitch | — | 1.0 mm |
| Speed Grade | — | 3 |