EP3SE260F1517I4L vs EP3SE260F1517C3N Perbandingan
Perbandingan bersamaan detil EP3SE260F1517I4L dari Intel dan EP3SE260F1517C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517I4L | EP3SE260F1517C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Series | Stratix III | — |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | 16,672,768 bits (16.7 Mbits) |
| Maximum User I/O | 976 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Temperature Grade | Industrial | — |
| Speed Grade | I4 | C3 (commercial) |
| Lead-Free / RoHS | Yes (L suffix) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Process Technology | 65 nm CMOS | 65 nm TSMC low-power CMOS |
| DSP Blocks (18x18 Multipliers) | 768 | 816 |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | — |
| Level MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| User I/Os | — | 976 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Paket | — | 1517-BBGA (FCBGA) |
| Suhu Hubung Kerja | — | 0 C to +85 C (commercial) |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |