EP3SE260F1517I4N vs EP3SE260H780C3N Perbandingan
Perbandingan bersamaan detil EP3SE260F1517I4N dari Intel dan EP3SE260H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Waktu Beli TerakhirIntel
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
EP3SE260H780C3N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517I4N | EP3SE260H780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Series | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | [DATA_NEEDED: number of DSP blocks and precision] |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 40 nm CMOS |
| Paket | 1517-BBGA, FCBGA | 780-BBGA, FCBGA (H780) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Suhu Kerja | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (C grade, commercial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Level MSL | [DATA_NEEDED: MSL classification] | — |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| User I/Os | — | 488 |
| Number of Pins / Balls | — | 780 |
| Maximum Core Frequency | — | [DATA_NEEDED: maximum core frequency MHz] |
| Supply Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal V] |
| Status RoHS | — | Compliant (lead-free 'N' suffix) |
| Tingkat Sensitivitas Kekeringan (MSL) | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Configuration Method | — | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel |
| Design Toolchain | — | Altera Quartus II (legacy); Intel Quartus Prime |