EP3SE260F1517I4N vs EP3SE260H780C3N 比較
詳細並排比較 EP3SE260F1517I4N 由 Intel 與 EP3SE260H780C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517I4N | EP3SE260H780C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Series | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | [DATA_NEEDED: number of DSP blocks and precision] |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 40 nm CMOS |
| 封裝 | 1517-BBGA, FCBGA | 780-BBGA, FCBGA (H780) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| 工作溫度 | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (C grade, commercial) |
| Operating Temperature Grade | Industrial (I4) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSL 等級 | [DATA_NEEDED: MSL classification] | — |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| User I/Os | — | 488 |
| Number of Pins / Balls | — | 780 |
| Maximum Core Frequency | — | [DATA_NEEDED: maximum core frequency MHz] |
| Supply Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal V] |
| RoHS 狀態 | — | Compliant (lead-free 'N' suffix) |
| 濕度敏感等級 (MSL) | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Configuration Method | — | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel |
| Design Toolchain | — | Altera Quartus II (legacy); Intel Quartus Prime |