EP3SE260H780C2N vs EP3SE260H780C4N Perbandingan
Perbandingan bersamaan detil EP3SE260H780C2N dari Intel dan EP3SE260H780C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260H780C2N | EP3SE260H780C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.86 V to 1.15 V |
| Paket | 780-BGA FCBGA | 780-ball FCBGA (Flip Chip BGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Rentang Suhu Kerja | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| Level MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Status RoHS | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | 65 nm CMOS |
| Family | — | Stratix III E (Enhanced) |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Maximum Core Clock Frequency | — | 450 MHz |
| Tingkat Sensitivitas Kekeringan (MSL) | — | 3 (168 hours) |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Configuration Method | — | Serial/Parallel via Quartus II |