EP3SE260H780C2N vs EP3SE260H780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C2N sa pamamagitan ng Intel at EP3SE260H780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780C2N | EP3SE260H780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.86 V to 1.15 V |
| Packhaging | 780-BGA FCBGA | 780-ball FCBGA (Flip Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Hanay ng Temperature na Operasyon | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| Level ng MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | 65 nm CMOS |
| Family | — | Stratix III E (Enhanced) |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Maximum Core Clock Frequency | — | 450 MHz |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | 3 (168 hours) |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Configuration Method | — | Serial/Parallel via Quartus II |