EP3SE260H780C2N vs EP3SE260H780C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C2N disebabkan oleh Intel dan EP3SE260H780C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780C2N | EP3SE260H780C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.86 V to 1.15 V |
| Kemasan | 780-BGA FCBGA | 780-ball FCBGA (Flip Chip BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Gambaran Suhu Operasi | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| Aras MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Status RoHS | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | 65 nm CMOS |
| Family | — | Stratix III E (Enhanced) |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Maximum Core Clock Frequency | — | 450 MHz |
| Tingkat sensitiviti Air Nama (MSL) | — | 3 (168 hours) |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Configuration Method | — | Serial/Parallel via Quartus II |