EP3SE260H780C2N vs EP3SE50F780C2N Perbandingan
Perbandingan bersamaan detil EP3SE260H780C2N dari Intel dan EP3SE50F780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260H780C2N | EP3SE50F780C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 47,500 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | 488 |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.9 V to 1.1 V |
| Paket | 780-BGA FCBGA | 780-ball FC-FBGA (FBGA-780) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Rentang Suhu Kerja | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C2 |
| Level MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Status RoHS | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | Stratix III Enhanced (E) |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Embedded Memory | — | 5,760,000 bits |
| DSP Blocks | — | Yes (number not in source data) |
| Transceiver Channels | — | 12 (data rate not in source data) |
| Process Technology | — | 65 nm CMOS |
| Maximum Internal Clock Frequency | — | 600 MHz |
| Temperature Grade | — | Commercial (C2) |
| Lead Free | — | Yes |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel |