EP3SE260H780C2N vs EP3SE50F780C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C2N sa pamamagitan ng Intel at EP3SE50F780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780C2N | EP3SE50F780C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 47,500 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | 488 |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.9 V to 1.1 V |
| Packhaging | 780-BGA FCBGA | 780-ball FC-FBGA (FBGA-780) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Hanay ng Temperature na Operasyon | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C2 |
| Level ng MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | Stratix III Enhanced (E) |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Embedded Memory | — | 5,760,000 bits |
| DSP Blocks | — | Yes (number not in source data) |
| Transceiver Channels | — | 12 (data rate not in source data) |
| Process Technology | — | 65 nm CMOS |
| Maximum Internal Clock Frequency | — | 600 MHz |
| Temperature Grade | — | Commercial (C2) |
| Lead Free | — | Yes |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel |