EP3SE260H780C4L vs EP3SE260H780C2N Perbandingan

Perbandingan bersamaan detil EP3SE260H780C4L dari Intel dan EP3SE260H780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780C4L EP3SE260H780C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Family Stratix III E —
Logic Elements 255,000 255,000
LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 (16.7 Mbit) 16,672,768
User I/O Count 488 488
Paket 780-ball FCBGA (HBGA 33x33 mm) 780-BGA FCBGA
Speed Grade C4 (middle/slow tier) C2
Core Voltage 0.9 V (nominal) 0.9 V
Suhu Hubung Kerja 0C to +85C (commercial) —
Tipe Mounting Surface Mount (flip-chip BGA) Surface Mount
Level MSL [DATA_NEEDED: MSL level] 3 (168 hours)
Status RoHS Compliant (lead-free per datasheet) [DATA_NEEDED: rohs status]
Transceivers Up to 24 multi-gigabit transceivers —
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers —
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ —
Series — Stratix III E
LABs / CLBs — 10,200
Number of Transceivers — [DATA_NEEDED: transceiver count]
Rentang Suhu Kerja — Commercial (0C to +85C)
Reflow Peak Time Max — 40 s
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

Spek dan Sumber

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