EP3SE260H780C4L vs EP3SE260H780C2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4L sa pamamagitan ng Intel at EP3SE260H780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260H780C4L EP3SE260H780C2N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III E —
Logic Elements 255,000 255,000
LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 (16.7 Mbit) 16,672,768
User I/O Count 488 488
Packhaging 780-ball FCBGA (HBGA 33x33 mm) 780-BGA FCBGA
Speed Grade C4 (middle/slow tier) C2
Core Voltage 0.9 V (nominal) 0.9 V
Temperature ng Junction na Operasyon 0C to +85C (commercial) —
Uri ng Pagpapasok Surface Mount (flip-chip BGA) Surface Mount
Level ng MSL [DATA_NEEDED: MSL level] 3 (168 hours)
Tindminan RoHS Compliant (lead-free per datasheet) [DATA_NEEDED: rohs status]
Transceivers Up to 24 multi-gigabit transceivers —
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers —
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ —
Series — Stratix III E
LABs / CLBs — 10,200
Number of Transceivers — [DATA_NEEDED: transceiver count]
Hanay ng Temperature na Operasyon — Commercial (0C to +85C)
Reflow Peak Time Max — 40 s
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

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